Sigrity software for simulation and signal integrity in high-frequency circuits. With the advancement of digital processing technology, the need for faster processing has grown increasingly, Prdzashgrhayy that necessarily needs to work faster circuits with higher processing speeds and higher frequencies are located. By increasing the speed signals for accurate speed up the signals on routes that are mounted on boards PCB or boards laminated issues and new problems arises in the case of Field, gripped engineers will be events such as interference, distortion and noise and signal integrity at high frequencies cause to be subject to threats.
To minimize these threats, compensate them and increase the quality of high-speed circuits, needs analysis and corrective actions that the software Allegro Sigrity it is convenient for us. The software combines technology with design, editing and routing IC and PCB coordinate Cadence® Allegro® enables advanced analysis of both pre-layout and post-layout provides for users.
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The software is designed to examine various scenarios in the initial phases allows accurate design and redesign minimized. This software supports reading and writing directly on the PCB and IC design of Allego’s database. Accurate simulator based on SPICE as well as built-solver for 2d and 3d extracts the user. The software also modeling the transistor-level input and output functions include power-aware IBIS 5.0 support.
摄氏温度求解器使用创新的多物理场技术来检测和解决热合规性问题。通过将用于实体结构的有限元分析（FEA）与用于流体的计算流体动力学（CFD）相结合，Celsius Thermal Solver可在单个工具中进行完整的系统分析。此外，摄氏温度求解器会根据高级3D结构中的实际电功率流执行静态（稳态）和动态（瞬态）电热联合仿真。
Celsius Thermal Solver在ThermalLIVE 2019上被选为2019年度热管理产品。推出了
The Sigrity products development team is pleased to announce the availability of Sigrity and Systems Analysis 2021.1. The Sigrity products are basically divided into two categories: on the one hand the analysis of the power supply system (Power Integrity) and on the other hand the signal integrity considering the fluctuations of the current and voltage supply.
Sigrity and Systems Analysis 2021.1 - Release Highlights
Systems Analysis 2021.1
The following new products and features have been added to the release:
- Celsius Thermal Solver Enhancements
- Clarity 3D Solver Enhancements
- New Clarity 3D Transient Solver Introduced
- New Unified GUI Platform Introduced
Systems Analysis 2021.1 what's new
Celsius Thermal Solver Enhancements
- Assigning Different Initial Conditions for Different Objects
In Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules, instead of specifying a uniform initial (ambient) temperature for the entire project, you can now specify different initial temperature values for different objects in the design. During analysis, such objects are initialized at the specified temperature value instead of the ambient temperature used for the rest of the project.
- Nonlinear Material Properties Added in the Material Library
You can now define materials with nonlinear properties, such as, viscoplasticity, fatigue, and failure in Celsius. This helps you study the structural response of your design when using materials with a nonlinear stress-strain relationship.
- Defining Structural Load Boundary Conditions
You can now perform structural load analysis of your design by specifying nodal and surface loads as boundary conditions in Celsius Solid Objects Simulation for 3D Structures module. This can help you study the effect of different loads on the deformation of materials and its impact on the simulation.
- Time-dependent Ambient Temperature Support
For transient analysis in Celsius Fluid Flow Simulation module, instead of defining a constant ambient temperature for the entire simulation, you can now define timedependent ambient temperature. This option helps model the scenarios where the ambient temperature can vary with time.
- Time-dependent Flow Rate and Flow Temperature Support
In the Celsius Fluid Flow Simulation module, you can now define time-dependent flow rate and flow temperature for an opening on the chassis wall. This helps you model more realistic scenarios, where the opening’s inlet flow rate and/or temperature can vary with time.
- 2D and 3D Probes Support in Celsius Fluid Flow Simulation
You can now add 2D and 3D probes in the Celsius Fluid Flow Simulation module to collect the 2D and 3D probe data. 3D probes collect the maximum, minimum, and average temperature data, while 2D probes collect the mean temperature in, mean temperature out, and net flow data. After the simulation run, you can use the probing data to analyze the results.
- Post-processing Enhancements
You now have the ability to post-process your simulation results within the Celsius Thermal Solver interface. Celsius lets you plot your simulation results in a new ParaView instance within the Layout pane. This capability is available through the Field-Plot option in both Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules.
Clarity 3D Solver Enhancements
- Adaptive Mesh Refinement Stage Improved
The mesh refinement priority and the mesh quality have been improved in the adaptive mesh refinement stage that results in a more stable convergence trend and a more reliable final mesh.
- Far-field Processing Enhanced
The performance of far-field processing has been improved significantly. Now, you can load and view the results for large designs much faster.
- New Geometry Healing Options Added
Clarity 3D Workbench now provides a couple of new options that enable you to remove or repair the bad faces of a geometry that are introduced when importing a design.
- Support for New Boundary Conditions Added
Two new boundary conditions, impedance boundary and RLC boundary, have been added in Clarity 3D Workbench. The impedance boundary condition is used to model the resistive surfaces while the RLC boundary condition is used to model lumped resistors, inductors, and capacitors.
- Presimulation Validation Enhanced
Presimulation validation has been enhanced in both Clarity 3D Workbench and Clarity 3D Layout. Both the tools now perform extensive checks during presimulation validation so that most of the errors can be detected and resolved prior to running the simulation.
New Clarity 3D Transient Solver Introduced
A new Finite Difference Time Domain (FDTD) solver, Clarity 3D Transient Solver, has been introduced that enables you to obtain results for a wide frequency band with a single simulation run as compared to other frequency domain solvers that require multiple runs for several frequencies.
New Unified GUI Platform Introduced
A new unified GUI platform is now available for Clarity 3D Workbench, Celsius Thermal Solver, and Clarity 3D Transient Solver tools. You can now access these tools from a single GUI, and also easily switch from one tool to another without the need to open the tool separately.
Sigrity 2021.1
The following new products and features have been added to the release:
- XtractIM Enhancements
- SystemSI Migrated to a New User Interface
- New SPEEDEM Tool Introduced
- Support for Distributed Computing Added
- Sigrity Suite Renamed to Layout Workbench
- Gds2Spd User Interface Improved
Sigrity 2021.1 what's new
XtractIM Enhancements
- Support for Local Silicon Interconnect (LSI) Extraction
XtractIM now supports the extraction of Local Silicon Interconnect (LSI) in packages with LSI and short-via-array.
- Multi-profile Ball/Bump Support for Single Component
In XtractIM, while creating solder ball/bumps you can now add multiple profiles based on the padstack size. This allows you to generate new sub-circuits from selected pin nodes.
SystemSI Migrated to a New User Interface
SystemSI has been migrated to a new user interface. To continue using the extensive features of SystemSI:
- OrCAD/Allegro 17.4 (SPB174) HotFix
- Sigrity and Systems Analysis 2021.1
On Windows, open the new SystemSI from the Cadence System Analysis folder in the Start menu.
New SPEEDEM Tool Introduced
SPEED2000 is now known as SPEEDEM. SPEEDEM comes with complete support for rigidflex designs including cross-hatch planes and multi-zone stackups, enhanced time domain engine performance, and ERC modularization.
Support for Distributed Computing Added
Like the Celsius Thermal Solver and Clarity 3D Solver, now OptimizePI, PowerSI, PowerDC, and XtractIM also support distributed computing. Using this functionality, you can perform the simulation on a single (local) computer or distribute the simulation run across multiple computers. However, this functionality is available only if you select the Tier II license (OptimizePI II, PowerSI II, PowerDC II, or XtractIM II) from the Choose Licenses Suite dialog box when launching Layout Workbench.
Sigrity Suite Renamed to Layout Workbench
Sigrity Suite is now known as Layout Workbench. In this release, the following tools have been added to Layout Workbench:
- Celsius Layout
- OptimiziPI
- PowerDC
Gds2Spd User Interface Improved
The Gds2Spd translator interface has been revamped to make the design more intuitive for ensuring better flow and navigation. Text labels have also been revisited to make them more meaningful and simplify the options' usage.
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Clarity 3D Solver
Clarity 3D Solver专为电磁和电力电子设备分析和仿真而设计。它在电磁仿真，近线性可扩展性和真正的3D系统分析方面提供了相当大的性能改进。
Clarity 3D Solver包含ClarityTM 3D Layout和ClarityTM 3D Workbench GUI工具，可用于设计PCB，IC封装（ICP）和IC上系统（SoIC）设计的关键互连。
Sigrity PowerSI中的
不连续性处理选项已添加新的不连续性处理选项，以在形状处理期间自动处理不连续性。
Sigrity OptimizePI和Sigrity PowerDC中的PowerTree拓扑设置
引入了“ PowerTree设置-一步创建工作区”选项，以允许在OptimizePI或PowerDC工作区中使用PowerTree拓扑设置，而无需从环境切换。
Sigrity中的多芯片封装对EPA检查的支持XtractIM
多芯片封装现在支持电气性能评估（EPA）检查。
Features and Applications Allegro Sigrity:
信号完整性（SI）是大多数系统设计人员的祸根。使这些信号在设计的所有曲折中完整无缺地传递，可能会让人发狂。但是，现代信号完整性设计和分析是当今大多数高性能系统的推动灵魂。Cadence的Sigrity工具在信号和电源完整性方面处于行业领先地位。
与Cadence PCB和IC封装设计工具集成后，用于信号完整性（SI）和电源完整性（PI）的Sigrity解决方案可提供布局前和布局后的高级分析。在设计周期的早期进行操作可以进行“假设”场景探索，设置更准确的设计约束，并减少设计迭代。Sigrity工具直接读取和写入Allegro PCB和IC封装设计数据库，以快速，准确地集成结果。它提供了一个基于SPICE的模拟器和嵌入式现场求解器，用于提取2D和3D结构。它支持晶体管级和行为I / O建模，包括使用IBIS模型进行功耗感知的仿真。可以在布局前探索并行总线和串行通道体系结构以比较替代方案，或者在布局后进行探索以对所有相关信号进行全面分析。
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.
Product: Cadence Sigrity and Systems Analysis
Version: 2021.1
Supported Architectures: x64
Website Home Page : www.cadence.com
Language: english
System Requirements: PC *
Size: 5.8 Gb
* System Requirements:
Hardware and Software Requirements
Operating System
- Windows 10 (64-bit)
- Windows 2012 Server (All service packs)
- Windows 2016 Server (All service packs)
- Windows 2019 Server
Minimum Hardware
- x86_64 Compatible (includes P4 EMT and AMD Opteron)
- 8 GB RAM
- Virtual memory at least twice physical memory
- 50 GB free disk space
- 1,024 x 768 display resolution with true color (16bit color)
- Broadband Internet connection for some service
- Ethernet card (for network communications and security hostID)
- Three-button Microsoft-compatible mouse
Recommended Hardware
- Intel Core i7 4.30 GHz or AMD Ryzen 7 4.30 GHz with at least 4 cores
- 64 GB RAM or higher
- 500 GB free disk space
- SSD is recommended for primary operating system (OS) and simulation working directory
- Dedicated graphics card with 1 GB video memory or higher
- Large monitor (or two) with Full HD resolution or higher
- Broadband Internet connection for some services
- Three button mouse with scroll wheel
- Full size keyboard
(出售内容)
To minimize these threats, compensate them and increase the quality of high-speed circuits, needs analysis and corrective actions that the software Allegro Sigrity it is convenient for us. The software combines technology with design, editing and routing IC and PCB coordinate Cadence® Allegro® enables advanced analysis of both pre-layout and post-layout provides for users.
The software is designed to examine various scenarios in the initial phases allows accurate design and redesign minimized. This software supports reading and writing directly on the PCB and IC design of Allego’s database. Accurate simulator based on SPICE as well as built-solver for 2d and 3d extracts the user. The software also modeling the transistor-level input and output functions include power-aware IBIS 5.0 support.
摄氏温度求解器使用创新的多物理场技术来检测和解决热合规性问题。通过将用于实体结构的有限元分析（FEA）与用于流体的计算流体动力学（CFD）相结合，Celsius Thermal Solver可在单个工具中进行完整的系统分析。此外，摄氏温度求解器会根据高级3D结构中的实际电功率流执行静态（稳态）和动态（瞬态）电热联合仿真。
Celsius Thermal Solver在ThermalLIVE 2019上被选为2019年度热管理产品。推出了
The Sigrity products development team is pleased to announce the availability of Sigrity and Systems Analysis 2021.1. The Sigrity products are basically divided into two categories: on the one hand the analysis of the power supply system (Power Integrity) and on the other hand the signal integrity considering the fluctuations of the current and voltage supply.
Sigrity and Systems Analysis 2021.1 - Release Highlights
Systems Analysis 2021.1
The following new products and features have been added to the release:
- Celsius Thermal Solver Enhancements
- Clarity 3D Solver Enhancements
- New Clarity 3D Transient Solver Introduced
- New Unified GUI Platform Introduced
Systems Analysis 2021.1 what's new
Celsius Thermal Solver Enhancements
- Assigning Different Initial Conditions for Different Objects
In Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules, instead of specifying a uniform initial (ambient) temperature for the entire project, you can now specify different initial temperature values for different objects in the design. During analysis, such objects are initialized at the specified temperature value instead of the ambient temperature used for the rest of the project.
- Nonlinear Material Properties Added in the Material Library
You can now define materials with nonlinear properties, such as, viscoplasticity, fatigue, and failure in Celsius. This helps you study the structural response of your design when using materials with a nonlinear stress-strain relationship.
- Defining Structural Load Boundary Conditions
You can now perform structural load analysis of your design by specifying nodal and surface loads as boundary conditions in Celsius Solid Objects Simulation for 3D Structures module. This can help you study the effect of different loads on the deformation of materials and its impact on the simulation.
- Time-dependent Ambient Temperature Support
For transient analysis in Celsius Fluid Flow Simulation module, instead of defining a constant ambient temperature for the entire simulation, you can now define timedependent ambient temperature. This option helps model the scenarios where the ambient temperature can vary with time.
- Time-dependent Flow Rate and Flow Temperature Support
In the Celsius Fluid Flow Simulation module, you can now define time-dependent flow rate and flow temperature for an opening on the chassis wall. This helps you model more realistic scenarios, where the opening’s inlet flow rate and/or temperature can vary with time.
- 2D and 3D Probes Support in Celsius Fluid Flow Simulation
You can now add 2D and 3D probes in the Celsius Fluid Flow Simulation module to collect the 2D and 3D probe data. 3D probes collect the maximum, minimum, and average temperature data, while 2D probes collect the mean temperature in, mean temperature out, and net flow data. After the simulation run, you can use the probing data to analyze the results.
- Post-processing Enhancements
You now have the ability to post-process your simulation results within the Celsius Thermal Solver interface. Celsius lets you plot your simulation results in a new ParaView instance within the Layout pane. This capability is available through the Field-Plot option in both Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules.
Clarity 3D Solver Enhancements
- Adaptive Mesh Refinement Stage Improved
The mesh refinement priority and the mesh quality have been improved in the adaptive mesh refinement stage that results in a more stable convergence trend and a more reliable final mesh.
- Far-field Processing Enhanced
The performance of far-field processing has been improved significantly. Now, you can load and view the results for large designs much faster.
- New Geometry Healing Options Added
Clarity 3D Workbench now provides a couple of new options that enable you to remove or repair the bad faces of a geometry that are introduced when importing a design.
- Support for New Boundary Conditions Added
Two new boundary conditions, impedance boundary and RLC boundary, have been added in Clarity 3D Workbench. The impedance boundary condition is used to model the resistive surfaces while the RLC boundary condition is used to model lumped resistors, inductors, and capacitors.
- Presimulation Validation Enhanced
Presimulation validation has been enhanced in both Clarity 3D Workbench and Clarity 3D Layout. Both the tools now perform extensive checks during presimulation validation so that most of the errors can be detected and resolved prior to running the simulation.
New Clarity 3D Transient Solver Introduced
A new Finite Difference Time Domain (FDTD) solver, Clarity 3D Transient Solver, has been introduced that enables you to obtain results for a wide frequency band with a single simulation run as compared to other frequency domain solvers that require multiple runs for several frequencies.
New Unified GUI Platform Introduced
A new unified GUI platform is now available for Clarity 3D Workbench, Celsius Thermal Solver, and Clarity 3D Transient Solver tools. You can now access these tools from a single GUI, and also easily switch from one tool to another without the need to open the tool separately.
Sigrity 2021.1
The following new products and features have been added to the release:
- XtractIM Enhancements
- SystemSI Migrated to a New User Interface
- New SPEEDEM Tool Introduced
- Support for Distributed Computing Added
- Sigrity Suite Renamed to Layout Workbench
- Gds2Spd User Interface Improved
Sigrity 2021.1 what's new
XtractIM Enhancements
- Support for Local Silicon Interconnect (LSI) Extraction
XtractIM now supports the extraction of Local Silicon Interconnect (LSI) in packages with LSI and short-via-array.
- Multi-profile Ball/Bump Support for Single Component
In XtractIM, while creating solder ball/bumps you can now add multiple profiles based on the padstack size. This allows you to generate new sub-circuits from selected pin nodes.
SystemSI Migrated to a New User Interface
SystemSI has been migrated to a new user interface. To continue using the extensive features of SystemSI:
- OrCAD/Allegro 17.4 (SPB174) HotFix
- Sigrity and Systems Analysis 2021.1
On Windows, open the new SystemSI from the Cadence System Analysis folder in the Start menu.
New SPEEDEM Tool Introduced
SPEED2000 is now known as SPEEDEM. SPEEDEM comes with complete support for rigidflex designs including cross-hatch planes and multi-zone stackups, enhanced time domain engine performance, and ERC modularization.
Support for Distributed Computing Added
Like the Celsius Thermal Solver and Clarity 3D Solver, now OptimizePI, PowerSI, PowerDC, and XtractIM also support distributed computing. Using this functionality, you can perform the simulation on a single (local) computer or distribute the simulation run across multiple computers. However, this functionality is available only if you select the Tier II license (OptimizePI II, PowerSI II, PowerDC II, or XtractIM II) from the Choose Licenses Suite dialog box when launching Layout Workbench.
Sigrity Suite Renamed to Layout Workbench
Sigrity Suite is now known as Layout Workbench. In this release, the following tools have been added to Layout Workbench:
- Celsius Layout
- OptimiziPI
- PowerDC
Gds2Spd User Interface Improved
The Gds2Spd translator interface has been revamped to make the design more intuitive for ensuring better flow and navigation. Text labels have also been revisited to make them more meaningful and simplify the options' usage.
Clarity 3D Solver
Clarity 3D Solver专为电磁和电力电子设备分析和仿真而设计。它在电磁仿真，近线性可扩展性和真正的3D系统分析方面提供了相当大的性能改进。
Clarity 3D Solver包含ClarityTM 3D Layout和ClarityTM 3D Workbench GUI工具，可用于设计PCB，IC封装（ICP）和IC上系统（SoIC）设计的关键互连。
Sigrity PowerSI中的
不连续性处理选项已添加新的不连续性处理选项，以在形状处理期间自动处理不连续性。
Sigrity OptimizePI和Sigrity PowerDC中的PowerTree拓扑设置
引入了“ PowerTree设置-一步创建工作区”选项，以允许在OptimizePI或PowerDC工作区中使用PowerTree拓扑设置，而无需从环境切换。
Sigrity中的多芯片封装对EPA检查的支持XtractIM
多芯片封装现在支持电气性能评估（EPA）检查。
Features and Applications Allegro Sigrity:
- Perform a wide range of SI analysis or Signal integrity (signal integrity)
- Early detection of design errors to increase success in the early phases
- Restrictions can be set quickly and accurately apply the basic processes
- Improve product performance through exploration and space solutions
- Evaluation of alternative topologies in infancy
- Production of S parameters of the topology and signal analysis in the form of parameter S
- Tables estimate interference designed to increase productivity
- Was approved after PCB design and IC design directly on boards
- Multiple evaluation and confirmation signals for different paths on silicon boards
信号完整性（SI）是大多数系统设计人员的祸根。使这些信号在设计的所有曲折中完整无缺地传递，可能会让人发狂。但是，现代信号完整性设计和分析是当今大多数高性能系统的推动灵魂。Cadence的Sigrity工具在信号和电源完整性方面处于行业领先地位。
与Cadence PCB和IC封装设计工具集成后，用于信号完整性（SI）和电源完整性（PI）的Sigrity解决方案可提供布局前和布局后的高级分析。在设计周期的早期进行操作可以进行“假设”场景探索，设置更准确的设计约束，并减少设计迭代。Sigrity工具直接读取和写入Allegro PCB和IC封装设计数据库，以快速，准确地集成结果。它提供了一个基于SPICE的模拟器和嵌入式现场求解器，用于提取2D和3D结构。它支持晶体管级和行为I / O建模，包括使用IBIS模型进行功耗感知的仿真。可以在布局前探索并行总线和串行通道体系结构以比较替代方案，或者在布局后进行探索以对所有相关信号进行全面分析。
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.
Product: Cadence Sigrity and Systems Analysis
Version: 2021.1
Supported Architectures: x64
Website Home Page : www.cadence.com
Language: english
System Requirements: PC *
Size: 5.8 Gb
* System Requirements:
Hardware and Software Requirements
Operating System
- Windows 10 (64-bit)
- Windows 2012 Server (All service packs)
- Windows 2016 Server (All service packs)
- Windows 2019 Server
Minimum Hardware
- x86_64 Compatible (includes P4 EMT and AMD Opteron)
- 8 GB RAM
- Virtual memory at least twice physical memory
- 50 GB free disk space
- 1,024 x 768 display resolution with true color (16bit color)
- Broadband Internet connection for some service
- Ethernet card (for network communications and security hostID)
- Three-button Microsoft-compatible mouse
Recommended Hardware
- Intel Core i7 4.30 GHz or AMD Ryzen 7 4.30 GHz with at least 4 cores
- 64 GB RAM or higher
- 500 GB free disk space
- SSD is recommended for primary operating system (OS) and simulation working directory
- Dedicated graphics card with 1 GB video memory or higher
- Large monitor (or two) with Full HD resolution or higher
- Broadband Internet connection for some services
- Three button mouse with scroll wheel
- Full size keyboard
(出售内容)