ANSYS Inc. has announced the availability of the 2021 R1 edition of its ANSYS Electronics Suite of electronics and electromagnetics simulation software solutions.![]()
What's New in ANSYS Electronics 2021 R1
General Electronics Desktop
- Commercial release of Mechanical and EMIT design types
- Ansys Cloud enhancements:
. Multi-step job submission
. Auto extraction o freport data
. Improved robustness and useability
- AbilitytoeditdesignsettingsinthePropertieswindow
- Enhanced Minerva integration, including direct project access
- Integration of optiSlang setup in Optimetrics (Beta, Windows only)
- New 3D modeler orientation gadget
- Support for Linux SLURM schedulers
- Automatic use of loopback address to improve reliability when connecting and disconnecting with VPN
- Ability to schedule, submit, and monitor jobs in standalone utility
- New menu command to validate parametric setups before solving
- Enhanced useability and workflows in Network Data Explorer
- Proxy3D Components (Beta)
- Enhancements to object-oriented property scripting (Beta)
HFSS
- Performance improvements:
. Improved iterative solver
. Improved performance for designs with many sources
. Ability to disable saving adaptive pass refinement files
- Improvements for SBR+ designs:
. Ability to visualize link source geometry in the target design
. Support for composite sources
. Features for automotive radar:
.. Parametric antenna arrays
.. FMCW in Range-Doppler solutions
. Enhancements to near field excitations and post-processing
. Linked antenna array source blockage in hybrid simulations
- FEM3D components mesh assembly (Beta)
- New automatic airbox region for 3D component arrays
- Embedded element pattern export
- Single-sided shell element field plotting
- Azimuth,elevation,andslantanglesfor far fields
- Finite Array Toolkit enhancements for amplitude tapering and sub-arrays
- Support for dispersive ports in the hybrid transient solver
- Option to prevent mesh-method fallback
- Option to suppress gamma, Zo in automatic S Parameter export
HFSS 3D Layout
- Performance improvements:
. Improved iterative solver
. Improved performance for designs with many ports
. Ability to disable saving adaptive pass refinement files
- Support for encrypted 3D components
- Q3D DC pointfor designs with 3D components
- FEM 3D components mesh assembly
- Improved dialog box for wirebond creation and editing
- Improvements to IC-mode meshing
- Support for package definitions and IDF
- Support for unencrypted iRCX technology in GDS import
SIwave
- Support for Granta material libraries
- Improved SYZ solver performance for designs with a very large number of ports
- New time-domain crosstalk scan for differential nets
- New integrated DDR wizard (Beta)
- Improved robustness of RLCG extraction
- Improved handling of CPM and Voltus models
- Option to visualize direction of incident waves
- Ability to specify location of capacitor and IBIS library directories
- Ability to run Icepak simulations from the Electronics installation
Maxwell
- Commercial release of new A-Phi transient solver
- Commercial release of partial mesh and solution from full rotational model
- Support for temperature-dependent core loss curves
- Support for spatially-varying materials characteristics and temperatures from XYZ datasets
- Extension of Litz wire modeling to RL matrix solutions
- Ability to create field plots of average loss
- Ability to parameterize adaptive frequency in eddy current solutions
- Enhancements to electric machine toolkit workflows and performance
- Ability to output transient electromagnetic forces to motion
- Support for element-based volumetric harmonic forc eineddy-current solutions
- Support for GPU acceleration in 3D real matrix solutions
- Ability tos pecify minimum and maximum nonlinear iterations
- Support for time-dependent excitations and motion in system coupling
- New 3D AC conduction solver (Beta)
Motor-CAD
- Export Maxwell (2D/3D) custom DXF geometry
- Using Maxwell User-Defined Primitive for hairpin coil definition with parametrized elements
- Optimization ratio-based geometry
- Force analysis improvements
- Use Maxwell solver as an electromagnetic option for driving cycle analysis
- Thermal end-winding modeling improvement
Icepak
- New ability to generate LTI ROM models in Twin Builder
- New flow links and improved workflows for network schematics
- Improved meshing automation and workflows
- Enhancements to concurrent meshing of regions
- Ability to import IDF datat hrough PCB components
- New fast Optimetrics option to copy meshes and solver inputs
- Ability to scale EM losses
- Ability to include dielectric loss in links from 3D Layout
- New ability to export solver monitor and residual data
- New dynamic thermal managements control (Beta)
Mechanical
- First commercial release in Electronics Desktop
- Fully integrated workflows and solutions on Windows and Linux
- Ability to set up and solvet hermal and modal simulations
- EM loss coupling with HFSS, Maxwell, and Q3D Extractor
- Rotating fluid boundary for electric machines
- Ability to link with heat transfer coefficient calculated in Icepak
Q3D Extractor
- CommercialreleaseofAnsysPRIME meshoptionfor CGsolver
- ImprovedperformanceofCGdirectsolver
- New uniformcurrentcircuitterminalsfor theAC-RLsolver (Beta)
Circuit
- Integration of Power Module Characterization Tool in Circuit designs
- Enhanced efficiency of dynamic links to field solvers
- AMI model support for single-ended devices
- Addition of parasitic elements to L and C models
- New support for eye measurements in countour plots
- Integration of SPISim SPro functionality into Network Data Explorer
- AdditionofNexximasdefaultsimulator for SPISim
- New SPISim COM capabilities, including PowerSum, Effective Return Loss (ERL)
- Improved DC passivity preservation in state-space fitting (Beta)
EMIT
- First commercial release in Electronics Desktop
- Improved coupling link with HFSS and HFSS 3D Layout
- Enhancements to workflows and usability of schematic editor
- Improved automation and scripting API
- Support for import of projects from classic EMIT
Twin Builder
Modelica Workflow Enhancements
- Support for Modelica package creation and library management
- Support to extend existing Modelica model
- Enhanced support for graphical annotation
- Faster loading of Modelica libraries and numerous other Modelica usability enhancements
Enhancements to ROMs and ROM Viewer
- Support for Fields Visualization in Dynamic ROM Builder
- Static ROM Builder supports geometrical parameter variation
- New Response Surface ROM Toolkit
- UI for Linear Parameter Varying (LPV) ROM
- Enhancements to the Static ROM Viewer
- Support for 3D Visualization during Simulation inside Twin Builder
Battery and EV Verticalization
- Toolkit to perform Failure Mode & Effect Analysis (FMEA)
- Motor Equivalent Circuit Toolkit for FMU export
- Battery Wizard improvement
- New EV Powertrain Library
- Toshiba component library as ACT extension
Export, Deployment, and Digital Twins
- Support for Schematic authoring, Python block, and simulation result explorer in Twin Deployer
- Export Twin project for sample deployment and DTDL for Microsoft Azure Digital Twin deployment
- Enhanced interoperability with all-inclusive Tool-coupling FMU
- Support for FMU (fixed step) export from Simulink for Twin Builder
- Improved compilation of FMUs and Twin Builder Fluent component on Linux
- Improved UI for adaptor for flsim in Fluent
Support for Enterprise Workflow
- Ansys Minerva integration in Twin Builder
- Ansys optiSLang integration in Twin Builder
General
- Numerous Useability and Performance Enhancements
ANSYS Electromagnetics Suite或ANSYS电子套件是几个用于模拟电磁系统的强大程序的集合。使用此产品，您可以高精度地模拟电磁系统，并研究电气和电磁设备的行为。该程序可用于各种工业分支。ANSYS Electromagnetics Suite适用于一般和特殊行业。例如，在机电设备中，例如电动机，发电机，变流器，继电器，电力电子或磁体设计以及MEMS中，该产品具有特殊功能，在高速芯片或高频微波组件中，例如内置芯片，IC和集成电路，PCB的内部连接，天线，微波组件以及最终的生物机械设备和EMI / EMC药物都有很多应用。
在普通模式和通用模式下，该程序具有许多应用程序，例如：研究激励下的性能特征，对设备周围或内部的电磁场进行可视化可视化，热效应和产生的热量，功率分配和调查变形模式，设计中关键参数的研究，例如：扭矩，力，电阻，阻抗，存储，S参数以及辐射和光发射等。该软件包包括用于低频电磁场仿真的三个软件ANSYS Maxwell，用于电磁波三维场仿真的ANSYS HFSS和用于复杂电子电源系统和电气控制系统仿真的ANSYS Simplorer，涵盖了工程师的所有需求。给了。
Ansys 电磁场仿真可帮助用户快速、经济地设计出创新性的电子电气产品。当今世界，高性能电子产品以及先进的电气化系统随处可见，因此电磁场对电路和系统的影响不容忽视。Ansys 软件能够对组件、电路和系统设计的电磁性能进行独立仿真，还可以对温度、振动和其他重要机械效应进行评估。这一独特的以电磁为中心的设计流程可帮助进一步实现高级通信系统、高速电子设备、机电设备组件和电力电子系统的首次通过的系统设计。
![]()
无线通信与射频
Ansys 高频电磁设计软件支持对天线与射频以及微波组件的性能进行设计、仿真和验证。微波集成电路和系统的建模功能可直接集成到 EM 求解器中，由此构建一个完整的系统验证平台，以对新一代射频和微波设计进行全系统验证。
PCB 与电子封装
Ansys 芯片-封装-系统 (CPS) 设计流程具有极其强大的仿真功能，采用该流程将大幅加快高速电子设备的电源完整性、信号完整性和 EMI 的分析速度。自动化热力分析和集成式结构分析功能在芯片-封装-电路板上提供了业内极为全面的芯片感知和系统感知仿真解决方案。
机电与电力电子
Ansys 机电与电力电子仿真软件非常适用于需要将电机、传感器和作动器与电子控制装置进行强大集成的应用领域。Ansys 软件可对这些组件之间的交互进行仿真，而设计流程则可集成热力和机械分析，以评估冷却策略并分析噪声、振动与声振粗糙度 (NVH) 等关键机械效应。
电子产品热管理
Ansys 电子产品热管理解决方案充分利用了先进的求解器技术和强大的网格自动划分功能，该解决方案将帮助用户快速进行对流和强制空气冷却策略的热交换和流体流动仿真。该解决方案可支持用户进行冷却策略设计，避免因过热导致 IC 封装、印刷电路板 (PCB)、数据中心、电力电子产品和电动机的性能降低。
此集合中包含的软件：
ANSYS电子桌面
ANSYS EMIT
ANSYS PEmag
ANSYS PExprt
ANSYS Savant
ANSYS SIwave
ANSYS Twin Builder
ANSYS Electronics Desktop is a comprehensive platform that enables electrical engineers to design and simulate various electrical, electronic and electromagnetic components, devices and systems. It is a unified interface which creates and analyzes electromagnetic (EM), thermal and circuit designs.
Engineers can access gold-standard tools such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and ANSYS Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, the Electronics Desktop includes direct links to the full ANSYS portfolio of thermal, fluid and mechanical solvers for comprehensive multiphysics analyses.
Engineers can integrate rigorous 2D and 3D physics analyses with system and circuit simulations, all inside a single framework called ANSYS Electronics Desktop. Any combination of products within the Electronics Desktop can be inserted into a single project. For instance, you can combine disparate design types such as HFSS, Circuit and Icepak into a single project. Schematics can be used to wire up different field solver models and create a model of a high-level system through dynamic links that combine 3D EM and SPICE circuit analyses.
Engineers can efficiently manage complex projects that require several different analysis tools to predict the operation of their electronic products. Designs can also be parameterized. With Optimetrics, design variations can be studied and made available to other modules when the designs are included in a higher-level simulation. This allows engineers to conduct what-if experiments and study the effects of component design parameter variations on the behavior of the entire system.
RF Desense is high on the list of design challenges faced by engineers designing wireless electronic products. Engineers seeking a solution for desense will benefit from using ANSYS HFSS and EMIT to successfully identify and mitigate desense in wireless electronic products. This video gives an overview of the simulation technique used in HFSS and EMIT to solve problems pertaining to radio-frequency interference or RFI, desense, and co-existence. The video also describes the topics of RFI, RF Coexistence and RF Desense.
Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines.
Product: ANSYS Electronics
Version: 2021 R1 Suite
Supported Architectures: x64
Website Home Page : www.ansys.com
Language: english
System Requirements: PC *
Size: 13.8 Gb
* System Requirements:
Platform Support
Defining the optimum computer infrastructure for use of Ansys software begins with understanding the computing platforms that are tested and supported by Ansys. Download the link below to learn about the computing platforms we support as well as reference system architectures recommended by valued partners.
The PDF files below provide platform support information for the current Ansys release, including certification and test information for operating systems, graphics cards, job schedules and other platform components.
所需系统
Windows 7/8/8 / 8.1 / 10
推荐的最低配置（为实现最佳性能）：
支持的处理器：AMD Athlon 64，AMD Opteron，具有Intel EM64T支持的Intel Xeon，具有Intel EM64T支持的
Intel Pentium 4
视频卡：128位SVGA或PCI Express视频卡
硬盘空间4.5 GB
内存：8 GB
操作系统：Windows
(出售内容)
![]()
1. Uninstall (if exist) previous versions of ANSYS Electronics
2. Install ANSYS Electronics 2021 R1 Win64 Do not install ANSYS License Manager 2021 R1!
When asked for licensing select "I have a new license file" > Next and browse to "ansyslmd.lic" in crack folder
3. Overwrite original <AnsysEM program folder> (at setup by default C:\Program Files\AnsysEM) with cracked one
4. If you have environment variable ANSYSLIC_DIR make sure that it points to <AnsysEM program folder>\Shared Files\Licensing
(at setup by default C:\Program Files\AnsysEM\Shared Files\Licensing )
5. Run "SolidSQUADLoaderEnabler.reg" and confirm to add info into Windows registry
6. REBOOT computer
7. REBOOT!
8. Enjoy
What's New in ANSYS Electronics 2021 R1
General Electronics Desktop
- Commercial release of Mechanical and EMIT design types
- Ansys Cloud enhancements:
. Multi-step job submission
. Auto extraction o freport data
. Improved robustness and useability
- AbilitytoeditdesignsettingsinthePropertieswindow
- Enhanced Minerva integration, including direct project access
- Integration of optiSlang setup in Optimetrics (Beta, Windows only)
- New 3D modeler orientation gadget
- Support for Linux SLURM schedulers
- Automatic use of loopback address to improve reliability when connecting and disconnecting with VPN
- Ability to schedule, submit, and monitor jobs in standalone utility
- New menu command to validate parametric setups before solving
- Enhanced useability and workflows in Network Data Explorer
- Proxy3D Components (Beta)
- Enhancements to object-oriented property scripting (Beta)
HFSS
- Performance improvements:
. Improved iterative solver
. Improved performance for designs with many sources
. Ability to disable saving adaptive pass refinement files
- Improvements for SBR+ designs:
. Ability to visualize link source geometry in the target design
. Support for composite sources
. Features for automotive radar:
.. Parametric antenna arrays
.. FMCW in Range-Doppler solutions
. Enhancements to near field excitations and post-processing
. Linked antenna array source blockage in hybrid simulations
- FEM3D components mesh assembly (Beta)
- New automatic airbox region for 3D component arrays
- Embedded element pattern export
- Single-sided shell element field plotting
- Azimuth,elevation,andslantanglesfor far fields
- Finite Array Toolkit enhancements for amplitude tapering and sub-arrays
- Support for dispersive ports in the hybrid transient solver
- Option to prevent mesh-method fallback
- Option to suppress gamma, Zo in automatic S Parameter export
HFSS 3D Layout
- Performance improvements:
. Improved iterative solver
. Improved performance for designs with many ports
. Ability to disable saving adaptive pass refinement files
- Support for encrypted 3D components
- Q3D DC pointfor designs with 3D components
- FEM 3D components mesh assembly
- Improved dialog box for wirebond creation and editing
- Improvements to IC-mode meshing
- Support for package definitions and IDF
- Support for unencrypted iRCX technology in GDS import
SIwave
- Support for Granta material libraries
- Improved SYZ solver performance for designs with a very large number of ports
- New time-domain crosstalk scan for differential nets
- New integrated DDR wizard (Beta)
- Improved robustness of RLCG extraction
- Improved handling of CPM and Voltus models
- Option to visualize direction of incident waves
- Ability to specify location of capacitor and IBIS library directories
- Ability to run Icepak simulations from the Electronics installation
Maxwell
- Commercial release of new A-Phi transient solver
- Commercial release of partial mesh and solution from full rotational model
- Support for temperature-dependent core loss curves
- Support for spatially-varying materials characteristics and temperatures from XYZ datasets
- Extension of Litz wire modeling to RL matrix solutions
- Ability to create field plots of average loss
- Ability to parameterize adaptive frequency in eddy current solutions
- Enhancements to electric machine toolkit workflows and performance
- Ability to output transient electromagnetic forces to motion
- Support for element-based volumetric harmonic forc eineddy-current solutions
- Support for GPU acceleration in 3D real matrix solutions
- Ability tos pecify minimum and maximum nonlinear iterations
- Support for time-dependent excitations and motion in system coupling
- New 3D AC conduction solver (Beta)
Motor-CAD
- Export Maxwell (2D/3D) custom DXF geometry
- Using Maxwell User-Defined Primitive for hairpin coil definition with parametrized elements
- Optimization ratio-based geometry
- Force analysis improvements
- Use Maxwell solver as an electromagnetic option for driving cycle analysis
- Thermal end-winding modeling improvement
Icepak
- New ability to generate LTI ROM models in Twin Builder
- New flow links and improved workflows for network schematics
- Improved meshing automation and workflows
- Enhancements to concurrent meshing of regions
- Ability to import IDF datat hrough PCB components
- New fast Optimetrics option to copy meshes and solver inputs
- Ability to scale EM losses
- Ability to include dielectric loss in links from 3D Layout
- New ability to export solver monitor and residual data
- New dynamic thermal managements control (Beta)
Mechanical
- First commercial release in Electronics Desktop
- Fully integrated workflows and solutions on Windows and Linux
- Ability to set up and solvet hermal and modal simulations
- EM loss coupling with HFSS, Maxwell, and Q3D Extractor
- Rotating fluid boundary for electric machines
- Ability to link with heat transfer coefficient calculated in Icepak
Q3D Extractor
- CommercialreleaseofAnsysPRIME meshoptionfor CGsolver
- ImprovedperformanceofCGdirectsolver
- New uniformcurrentcircuitterminalsfor theAC-RLsolver (Beta)
Circuit
- Integration of Power Module Characterization Tool in Circuit designs
- Enhanced efficiency of dynamic links to field solvers
- AMI model support for single-ended devices
- Addition of parasitic elements to L and C models
- New support for eye measurements in countour plots
- Integration of SPISim SPro functionality into Network Data Explorer
- AdditionofNexximasdefaultsimulator for SPISim
- New SPISim COM capabilities, including PowerSum, Effective Return Loss (ERL)
- Improved DC passivity preservation in state-space fitting (Beta)
EMIT
- First commercial release in Electronics Desktop
- Improved coupling link with HFSS and HFSS 3D Layout
- Enhancements to workflows and usability of schematic editor
- Improved automation and scripting API
- Support for import of projects from classic EMIT
Twin Builder
Modelica Workflow Enhancements
- Support for Modelica package creation and library management
- Support to extend existing Modelica model
- Enhanced support for graphical annotation
- Faster loading of Modelica libraries and numerous other Modelica usability enhancements
Enhancements to ROMs and ROM Viewer
- Support for Fields Visualization in Dynamic ROM Builder
- Static ROM Builder supports geometrical parameter variation
- New Response Surface ROM Toolkit
- UI for Linear Parameter Varying (LPV) ROM
- Enhancements to the Static ROM Viewer
- Support for 3D Visualization during Simulation inside Twin Builder
Battery and EV Verticalization
- Toolkit to perform Failure Mode & Effect Analysis (FMEA)
- Motor Equivalent Circuit Toolkit for FMU export
- Battery Wizard improvement
- New EV Powertrain Library
- Toshiba component library as ACT extension
Export, Deployment, and Digital Twins
- Support for Schematic authoring, Python block, and simulation result explorer in Twin Deployer
- Export Twin project for sample deployment and DTDL for Microsoft Azure Digital Twin deployment
- Enhanced interoperability with all-inclusive Tool-coupling FMU
- Support for FMU (fixed step) export from Simulink for Twin Builder
- Improved compilation of FMUs and Twin Builder Fluent component on Linux
- Improved UI for adaptor for flsim in Fluent
Support for Enterprise Workflow
- Ansys Minerva integration in Twin Builder
- Ansys optiSLang integration in Twin Builder
General
- Numerous Useability and Performance Enhancements
ANSYS Electromagnetics Suite或ANSYS电子套件是几个用于模拟电磁系统的强大程序的集合。使用此产品，您可以高精度地模拟电磁系统，并研究电气和电磁设备的行为。该程序可用于各种工业分支。ANSYS Electromagnetics Suite适用于一般和特殊行业。例如，在机电设备中，例如电动机，发电机，变流器，继电器，电力电子或磁体设计以及MEMS中，该产品具有特殊功能，在高速芯片或高频微波组件中，例如内置芯片，IC和集成电路，PCB的内部连接，天线，微波组件以及最终的生物机械设备和EMI / EMC药物都有很多应用。
在普通模式和通用模式下，该程序具有许多应用程序，例如：研究激励下的性能特征，对设备周围或内部的电磁场进行可视化可视化，热效应和产生的热量，功率分配和调查变形模式，设计中关键参数的研究，例如：扭矩，力，电阻，阻抗，存储，S参数以及辐射和光发射等。该软件包包括用于低频电磁场仿真的三个软件ANSYS Maxwell，用于电磁波三维场仿真的ANSYS HFSS和用于复杂电子电源系统和电气控制系统仿真的ANSYS Simplorer，涵盖了工程师的所有需求。给了。
Ansys 电磁场仿真可帮助用户快速、经济地设计出创新性的电子电气产品。当今世界，高性能电子产品以及先进的电气化系统随处可见，因此电磁场对电路和系统的影响不容忽视。Ansys 软件能够对组件、电路和系统设计的电磁性能进行独立仿真，还可以对温度、振动和其他重要机械效应进行评估。这一独特的以电磁为中心的设计流程可帮助进一步实现高级通信系统、高速电子设备、机电设备组件和电力电子系统的首次通过的系统设计。
无线通信与射频
Ansys 高频电磁设计软件支持对天线与射频以及微波组件的性能进行设计、仿真和验证。微波集成电路和系统的建模功能可直接集成到 EM 求解器中，由此构建一个完整的系统验证平台，以对新一代射频和微波设计进行全系统验证。
PCB 与电子封装
Ansys 芯片-封装-系统 (CPS) 设计流程具有极其强大的仿真功能，采用该流程将大幅加快高速电子设备的电源完整性、信号完整性和 EMI 的分析速度。自动化热力分析和集成式结构分析功能在芯片-封装-电路板上提供了业内极为全面的芯片感知和系统感知仿真解决方案。
机电与电力电子
Ansys 机电与电力电子仿真软件非常适用于需要将电机、传感器和作动器与电子控制装置进行强大集成的应用领域。Ansys 软件可对这些组件之间的交互进行仿真，而设计流程则可集成热力和机械分析，以评估冷却策略并分析噪声、振动与声振粗糙度 (NVH) 等关键机械效应。
电子产品热管理
Ansys 电子产品热管理解决方案充分利用了先进的求解器技术和强大的网格自动划分功能，该解决方案将帮助用户快速进行对流和强制空气冷却策略的热交换和流体流动仿真。该解决方案可支持用户进行冷却策略设计，避免因过热导致 IC 封装、印刷电路板 (PCB)、数据中心、电力电子产品和电动机的性能降低。
此集合中包含的软件：
ANSYS电子桌面
ANSYS EMIT
ANSYS PEmag
ANSYS PExprt
ANSYS Savant
ANSYS SIwave
ANSYS Twin Builder
ANSYS Electronics Desktop is a comprehensive platform that enables electrical engineers to design and simulate various electrical, electronic and electromagnetic components, devices and systems. It is a unified interface which creates and analyzes electromagnetic (EM), thermal and circuit designs.
Engineers can access gold-standard tools such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and ANSYS Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, the Electronics Desktop includes direct links to the full ANSYS portfolio of thermal, fluid and mechanical solvers for comprehensive multiphysics analyses.
Engineers can integrate rigorous 2D and 3D physics analyses with system and circuit simulations, all inside a single framework called ANSYS Electronics Desktop. Any combination of products within the Electronics Desktop can be inserted into a single project. For instance, you can combine disparate design types such as HFSS, Circuit and Icepak into a single project. Schematics can be used to wire up different field solver models and create a model of a high-level system through dynamic links that combine 3D EM and SPICE circuit analyses.
Engineers can efficiently manage complex projects that require several different analysis tools to predict the operation of their electronic products. Designs can also be parameterized. With Optimetrics, design variations can be studied and made available to other modules when the designs are included in a higher-level simulation. This allows engineers to conduct what-if experiments and study the effects of component design parameter variations on the behavior of the entire system.
RF Desense is high on the list of design challenges faced by engineers designing wireless electronic products. Engineers seeking a solution for desense will benefit from using ANSYS HFSS and EMIT to successfully identify and mitigate desense in wireless electronic products. This video gives an overview of the simulation technique used in HFSS and EMIT to solve problems pertaining to radio-frequency interference or RFI, desense, and co-existence. The video also describes the topics of RFI, RF Coexistence and RF Desense.
Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines.
Product: ANSYS Electronics
Version: 2021 R1 Suite
Supported Architectures: x64
Website Home Page : www.ansys.com
Language: english
System Requirements: PC *
Size: 13.8 Gb
* System Requirements:
Platform Support
Defining the optimum computer infrastructure for use of Ansys software begins with understanding the computing platforms that are tested and supported by Ansys. Download the link below to learn about the computing platforms we support as well as reference system architectures recommended by valued partners.
The PDF files below provide platform support information for the current Ansys release, including certification and test information for operating systems, graphics cards, job schedules and other platform components.
所需系统
Windows 7/8/8 / 8.1 / 10
推荐的最低配置（为实现最佳性能）：
支持的处理器：AMD Athlon 64，AMD Opteron，具有Intel EM64T支持的Intel Xeon，具有Intel EM64T支持的
Intel Pentium 4
视频卡：128位SVGA或PCI Express视频卡
硬盘空间4.5 GB
内存：8 GB
操作系统：Windows
(出售内容)
1. Uninstall (if exist) previous versions of ANSYS Electronics
2. Install ANSYS Electronics 2021 R1 Win64 Do not install ANSYS License Manager 2021 R1!
When asked for licensing select "I have a new license file" > Next and browse to "ansyslmd.lic" in crack folder
3. Overwrite original <AnsysEM program folder> (at setup by default C:\Program Files\AnsysEM) with cracked one
4. If you have environment variable ANSYSLIC_DIR make sure that it points to <AnsysEM program folder>\Shared Files\Licensing
(at setup by default C:\Program Files\AnsysEM\Shared Files\Licensing )
5. Run "SolidSQUADLoaderEnabler.reg" and confirm to add info into Windows registry
6. REBOOT computer
7. REBOOT!
8. Enjoy